Humidity is the deadly enemy of the quality of electronic products. How to modernize and effectively manage the humidity of the environment in which electronic products are stored to reduce corporate losses is an important task for high-tech electronic companies. These can be accomplished by automatic temperature and humidity recorders.
Content:
1. The harm of humidity to electronic components and the whole machine
Most electronic products require operation and storage in dry conditions. According to statistics, more than one-quarter of all industrially manufactured defective products worldwide are related to moisture hazards. For the electronics industry, the hazard of moisture has become one of the main factors affecting product quality.
(1) Integrated circuits: The harm of moisture to the semiconductor industry is mainly manifested in that moisture can penetrate into the IC through IC plastic packages and from gaps such as pins, resulting in IC moisture absorption.
Water vapor is formed in the heating part of the SMT process, and the resulting pressure causes the IC resin package to crack and oxidize the metal inside the IC device, resulting in product failure. In addition, when the device is soldered on the PCB, due to the release of water vapor pressure, it will also lead to virtual soldering.
According to the IPC-M190 J-STD-033 standard, SMD components after exposure to high humidity air must be placed in a dry box below 10% RH humidity for 10 times the exposure time to restore the component's "workshop" "Life" to avoid scrapping and ensure safety.
(2) Liquid crystal devices: Although glass substrates, polarizers, and filter lenses of liquid crystal devices such as liquid crystal displays are washed and dried during the production process, they will still be affected by moisture after the temperature is lowered, reducing the product's pass rate . Therefore, it should be stored in a dry environment below 40%RH after washing and drying.
(3) Other electronic devices: capacitors, ceramic devices, connectors, switch parts, solder, PCB, crystal, silicon wafer, quartz oscillator, SMT glue, electrode material adhesive, electronic paste, high-brightness devices, etc. Will be harmed by moisture.
(4) Electronic devices in the process of operation: between semi-finished products in the package and the next process; between PCB packaging and after packaging to power-on; IC, BGA, PCB, etc. after unpacking but not yet used; waiting for tin furnace Soldered devices; devices to be reheated after baking; finished products that have not been packaged, etc., will be exposed to moisture.
(5) Finished electronic complete machines will also be exposed to moisture during storage. If the storage time is too long in a high humidity environment, it will cause a failure. For the computer board CPU, etc., it will oxidize the gold finger and cause a bad contact.
The humidity of the production and storage environment of electronic industry products should be below 40%. Some varieties also require lower humidity
